Failure Analysis Engineer

Description:
Perform Failure Analysis on complex Microcircuits and discrete semiconductor devices. Generate Failure Analysis reports that are detailed, accurate, concise and timely in accordance with the process flow.


Essential Duties: Perform Microscopic Inspections, SEM/EDX Analyses, Electrical Probing, chemical de-processing, physical cross-sectioning, Radiographic Inspections and Scanning acoustic Microscopy. Generate reports & develop appropriate conclusions based upon physical/electrical results to assist customers, applications, manufacturing, & test in the elimination of reject or failing parts. Tracking & analysis of failures to determine root cause(s) and eliminate reoccurrences. Coordinate activities w/Design, Product, Application & Reliability Engineering groups. Complete failure analysis projects according to established cycle times. Create & develop new techniques to drive & streamline the Failure Analysis process. Assist in the improvement of the life cycle of the devices, by applying knowledge gleaned from failures & applications issues. Provide mentoring/training for junior staff members.
Qualification Requirements: BSEE (or equivalent) 5 years Failure Analysis experience on semiconductors Failure Analysis on semiconductors Experience using Microscopic Inspections, SEM/EDX Analyses, Electrical Probing, chemical de-processing, physical cross-sectioning, Radiographic Inspections and Scanning acoustic Microscopy Wafer Fab processing experience a plus. Excellent verbal and written communications skills

 

In return we offer excellent Benefits - Relocation assistance is available